Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packaging Materials Cover

Thomas M. Moore
Robert G. McKenna
C. Richard Brundle

In Stock Date: 
03/15/2010
Print Price: 
$108.95
Print ISBN: 
978-1-60650-187-0
E-book Price: 
$98.00
E-book ISBN: 
978-1-60650-189-4
Pages: 
274
Binding Type: 
Casebound

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and interfaces for thermal management -- Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.

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