Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packaging Materials Cover

Thomas Moore and Robert McKenna
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

In Stock Date: 
03/15/2010
Print Price: 
$89.95
Print ISBN: 
978-1-60650-187-0
Pages: 
274
Binding Type: 
Casebound
E-book Price: 
$81.00
E-book ISBN: 
978-1-60650-189-4
Bundle Price: 
$108.00
Bundle ISBN: 
978-1-60650-188-7

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This includes both the print and e-book version. Once purchased, your purchase confirmation will be e-mailed to you with a link to download the PDF. This PDF comes with no restrictions and can be loaded on your Kindle, Nook, or other e-reader device that supports PDF.

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.

Readers will find:

  • General overview of IC package reliability testing
  • Characterization for the electrical performance of IC packages
  • Understanding surface characteristics and interfaces for thermal management
  • Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more

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