Materials Characterization Series

Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packaging Materials Cover
Print Price: 
$98.95
In Stock Date: 
03/15/2010

Thomas Moore and Robert McKenna
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.

Readers will find:

Characterization of Polymers

Polymer Cover
Print Price: 
$98.95
In Stock Date: 
01/13/2010

Ned J. Chou, Stephen P. Kowalczyk, Ravi Saraf, and Ho-Ming Tong

Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Polymer are organic, often complex molecular compounds used as the building blocks for plastics, elastomers and various types of synthetic engineered materials. Polymer scientists and chemists are not always familiar with the characterization methods best used for polymeric materials. And knowing what characterization technology works best can make a huge difference in getting an accurate understanding of internal and surface microstructure and ultimately desired properties for the myriads of polymer applications in use today.

Characterization in Compound Semiconductor Processing

Characterization in Compound Semiconductor Processing cover
Print Price: 
$98.95
In Stock Date: 
11/24/2009

Yale E. Strausser and Gary E. McGuire

Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Compound semiconductors such as Gallium Arsenide, Gallium Aluminum Arsenide, and Indium Phosphide are often difficult to characterize and present a variety of challenges from substrate preparation, to epitaxial growth to dielectric film deposition to dopant introduction.

This book reviews the common classes of compound semiconductors, their physical, optical and electrical properties and the various types of methods used for characterizing them when analyzing for defects and application problems.

Characterization of Ceramics

Characterization of Ceramics Cover
Print Price: 
$98.95
In Stock Date: 
03/15/2010

Ronald Loehman
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Ceramics are, in a general definition, materials that consist of man-made, inorganic, non-metallic solid material—either existing in a crystalline state or non-crystalline state (i.e., glasses). Materials characterization techniques are used to ensure the structural and surface integrity of ceramics for their use in a wide variety of applications, from thermal resistance to advanced electronic and optical technologies like fiber optics to structural uses.

Characterization of Organic Thin Films

Characterization of Organic Thin Films cover
Print Price: 
$98.95
In Stock Date: 
12/12/2009

Abraham Ulman

Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Thin films based upon organic materials are at the heart of much of the revolution in modern technology, from advanced electronics, to optics to sensors to biomedical engineering.

This volume in the Materials Characterization series introduces the major common types of analysis used in characterizing of thin films and the various appropriate characterization technologies for each. Materials such as Langmuir-Blodgett films and self-assembled monolayers are first introduced, followed by analysis of surface properties and the various characterization technologies used for such.

Characterization of Optical Materials

Characterization of Optical Materials Cover
Print Price: 
$98.95
In Stock Date: 
03/08/2010

Gregory J. Exarhos
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Optical materials are prized for their properties such as reflection, refraction, absorption, emission, scattering, and diffraction of light in wavelengths ranging from 100 nm to 10 mm. Because small surface or atomic structure defects can have significant affects on those properties, characterization techniques that are sensitive to structures at those scales are presented for the relative effectiveness and particular applications.

Characterization of Composite Materials

Characterization of Composite Materials Cover
Print Price: 
$98.95
In Stock Date: 
04/01/2010

Hatsuo Ishida
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Composite materials make their way into all aspects of modern technological society, but particularly so for applications requiring great strength and light weight such as in the aerospace industry. Because they are hybrid heterogeneous materials, they can be difficult to characterize with any one single methodology.

This volume in the Materials Characterization Series will guide engineers and technicians on which methods work best and what to look for when reading results, be they from X-Ray diffraction, or Nuclear Magnetic Imaging.

Characterization of Catalytic Materials

Characterization of Catalytic Materials Cover
Print Price: 
$98.95
In Stock Date: 
03/15/2010

Israel E. Wachs
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

Catalytic materials are essential to nearly every commercial and industrial chemical process in order to make reaction times faster and more efficient. Understanding the microstructure of such materials is essential to designing improved catalytic properties.

This volume in the materials characterization series reviews the more common types of characterization methods used for understanding surface and structural properties of most types of commercially used catalytic materials.

Characterization of Metals and Alloys

Characterization of Metals and Alloys Cover
Print Price: 
$98.95
In Stock Date: 
04/15/2010

Paul Holloway and P.N. Vaidyanathan
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

A better understanding of the microstructure of metals and alloys has led to great advances in the performance and useful applications of these, the oldest of mankind’s engineered materials. This book in the Materials characterizations series focuses on the particular molecular and atomistic properties of metals insofar as how they affect the different techniques for measuring and analyzing internal structure, surface structure, and chemical/physical properties.

Characterization in Silicon Processing

Silicon Processing Cover
Print Price: 
$98.95
In Stock Date: 
12/24/2009

Yale E. Strausser
Series Editors: C. Richard Brundle, Charles A. Evans, Jr.

With a focus on the use of materials characterization techniques for silicon-based semiconductors, this volume in the Materials Characterization series focuses on the process flow of silicon wafer manufacture where materials properties, processing and associated problems are brought to the fore. The book is organized by the types of materials commonly associated with integrated silicon semiconductor circuits and the typical processes involved for each such material, including deposition, thermal treatment, and lithography. Readers will find features such as:

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