Materials Scientists and Engineers

Print Price: 

$108.95

E-book Price: 

$98.00

In Stock Date: 

03/15/2010

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.

Readers will find:

Print Price: 

$108.95

E-book Price: 

$98.00

In Stock Date: 

11/24/2009

Compound semiconductors such as Gallium Arsenide, Gallium Aluminum Arsenide, and Indium Phosphide are often difficult to characterize and present a variety of challenges from substrate preparation, to epitaxial growth to dielectric film deposition to dopant introduction.

This book reviews the common classes of compound semiconductors, their physical, optical and electrical properties and the various types of methods used for characterizing them when analyzing for defects and application problems.

Print Price: 

$108.95

E-book Price: 

$98.00

In Stock Date: 

12/12/2009

Thin films based upon organic materials are at the heart of much of the revolution in modern technology, from advanced electronics, to optics to sensors to biomedical engineering.

This volume in the Materials Characterization series introduces the major common types of analysis used in characterizing of thin films and the various appropriate characterization technologies for each. Materials such as Langmuir-Blodgett films and self-assembled monolayers are first introduced, followed by analysis of surface properties and the various characterization technologies used for such.

Print Price: 

$108.95

E-book Price: 

$98.00

In Stock Date: 

04/01/2010

Composite materials make their way into all aspects of modern technological society, but particularly so for applications requiring great strength and light weight such as in the aerospace industry. Because they are hybrid heterogeneous materials, they can be difficult to characterize with any one single methodology.

This volume in the Materials Characterization Series will guide engineers and technicians on which methods work best and what to look for when reading results, be they from X-Ray diffraction, or Nuclear Magnetic Imaging.

Print Price: 

$108.95

E-book Price: 

$98.00

In Stock Date: 

04/15/2010

A better understanding of the microstructure of metals and alloys has led to great advances in the performance and useful applications of these, the oldest of mankind’s engineered materials. This book in the Materials characterizations series focuses on the particular molecular and atomistic properties of metals insofar as how they affect the different techniques for measuring and analyzing internal structure, surface structure, and chemical/physical properties.